
Industry Challenges
- Thermal management for high-power compute modules
- Fast product cycles following new chip generations
- Low initial volumes with demanding quality expectations
- Supply of compute modules, memory and specialized components
- Enclosures that look premium without high tooling costs
Typical Products
- Edge AI boxes and gateways
- Camera and vision devices
- Carrier boards for compute modules
- Machined aluminum enclosures with heat sinks
- Developer kits and demo units
Prototype → Production
- Machined enclosures and PCBA prototypes for validation
- Thermal and functional testing of early units
- Pilot run with production test procedure
- Tooling decisions based on confirmed demand
Quality Control
- Functional and burn-in tests when specified
- Thermal interface and assembly checks
- Cosmetic standards for premium enclosures
- Firmware/image version verification








